11-19-2020, 06:53 PM
(11-19-2020, 12:27 PM)LMM Wrote:(11-19-2020, 12:36 AM)wildering Wrote: I cracked open the two other boards and ran memtest on them with no errors reported. I then transplanted that eMMC module onto the date code 5219 board and ran the test again. I was presented with a slew of errors. It's evident that, that ROCKPro64 (v2.1, 2018-07-02 5219) is also defective and will warrant an RMA.
I ran memtest with Debian an it seems ok. (v2.1, 2018-07-02). What is noticeable is the high temperature reached (70°C) in spite of a heatsink. Then I put it over a fan and it dropped below 50°C after 9 min
(11-19-2020, 12:27 PM)LMM Wrote:(11-19-2020, 12:36 AM)wildering Wrote: I cracked open the two other boards and ran memtest on them with no errors reported. I then transplanted that eMMC module onto the date code 5219 board and ran the test again. I was presented with a slew of errors. It's evident that, that ROCKPro64 (v2.1, 2018-07-02 5219) is also defective and will warrant an RMA.
I ran memtest with Debian an it seems ok. (v2.1, 2018-07-02). What is noticeable is the high temperature reached (70°C) in spite of a heatsink. Then I put it over a fan and it dropped below 50°C after 9 min
I don't know if it is a good practice (and a good idea) but I cut the conductive pad in order to be able to double the layer on the DDR chip to make the contact with the heatsink. Otherwise it probably does not
I don’t see how doubling the conductive pad would hurt, but I imagine conductivity would be impacted. It shouldn’t be necessary though, as I’ve found a single layer makes good contact with the heat sync. Plus in my case I didn’t have the chance to do anything other than run apt update, which shouldn’t cause a temperature spike at all. Plus both other boards run at a cool 45-50 degrees under moderate load with the tall heat sync and no fan.
The most likely cause of the segmentation faults we’ve been experiencing is defective chips from the manufacturer or them breaking during product assembly.