Space between SBC and bottom panel
#1
Just received my Pinebook Pro last Thursday, like it a lot so far. Wondering if anybody knows how much vertical clearance there is between the CPU/WiFi/eMMC and the bottom panel. I've been looking around here for the last few days and I've seen some people talking about adding thermal pads to those parts of the board to help with performance (I've heard the WiFi module in particular can get toasty). I don't even know how I would go about measuring the clearance.
#2
as you can imagine there is not much. i believe the height of the thermal pad on the cpu is documented, so there is your metric. there has been talk of just adding more padding to facilitate heat transfer to the bottom panel. i don't have any thermal issues and my pbp is under full load often... i'm not concerned, but it would be nice to improve upon this.
#3
(06-02-2020, 12:44 PM)xmixahlx Wrote: as you can imagine there is not much. i believe the height of the thermal pad on the cpu is documented, so there is your metric. there has been talk of just adding more padding to facilitate heat transfer to the bottom panel. i don't have any thermal issues and my pbp is under full load often... i'm not concerned, but it would be nice to improve upon this.

I'm sure the heat transfer is probably fine without any pads, but my experiences with Raspberry Pi's has taught me that any cooling at all does improve performance.
#4
it is not that extreme as a pi. my temps are 32-65c based on cpu load. i have not detected any throttling.


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