03-28-2021, 04:28 AM
(03-28-2021, 02:23 AM)dsimic Wrote: Your results are very good! Looking forward to the pictures.
I agree, there's no need to go overboard with a cooling solution, but the bad effects of the heat soak are the main cause for my attempts to improve the cooling. The overheating of the BQ24171 makes the PineBook Pro almost unusable for long compilation jobs.
Spreading the generated heat better over the back cover is exactly what I'm looking for, and, quite frankly, there's nothing more that could be done in the space available under the back cover. Also, nothing more is really needed either.
I've already bought a couple of flat heatpipes, so they're worth a try. Also, affixing the heatpipes requires less thermal epoxy than what's required for affixing a rather large piece of sheet metal. Although, I'm not sure if the approach with heatpipes is going to be less expensive in the end.
By the way, my plan is to use Phobya thermal epoxy.
here you go, i now added that green 2,5W/mK pad to cool the components under the shield. The entire area should now dissipate heat on the back cover.
PinebookPro v2.1 4xA53@1704Mhz / 2xA72@2208Mhz / GPU@1125Mhz / CCI-500@1200Mhz