11-11-2019, 11:31 AM
(11-11-2019, 09:40 AM)Luke Wrote:(11-10-2019, 10:07 AM)Tekchip Wrote: I've recently had my PBP apart. I hadn't updated uboot to boot SD without the hardware switch thrown and I borked the eMMC install. oops. That's not my point. My point is I noticed the PBP processor is using a heat transfer pad to transfer heat to the bottom panel. So the bottom panel appears to be an active part of the cooling system. We'd probably want someone from Pine to let us know if we're putting our hardware at risk of heat issues if we're adding an extra layer over the bottom panel.
If the answer is "that would be bad" maybe there's a way to design a skin with a cut out that allows the heat out but maintains the design. Maybe the pine cone part of the logo could be cut out and offset to match where the heat transfer pad contacts leaving some black metal exposed to dissipate heat but that's also part of the lower skins design.
If I'm not explaining clearly please let me know and I can draw some pictures or something.
You won't put your PBP at risk of overheating using a skin on it. The SOC will downclock long before any damage can be caused. Moreover, I doubt that the skin will seriously obstruct heat dissipation.
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After using my PBP for hours I feel the place where the cpu pad touches the lower case,
it is barely noticeably warmer than any other part of the lower case.
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LINUX = CHOICES
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**BCnAZ**
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