(11-10-2019, 10:07 AM)Tekchip Wrote: I've recently had my PBP apart. I hadn't updated uboot to boot SD without the hardware switch thrown and I borked the eMMC install. oops. That's not my point. My point is I noticed the PBP processor is using a heat transfer pad to transfer heat to the bottom panel. So the bottom panel appears to be an active part of the cooling system. We'd probably want someone from Pine to let us know if we're putting our hardware at risk of heat issues if we're adding an extra layer over the bottom panel.
If the answer is "that would be bad" maybe there's a way to design a skin with a cut out that allows the heat out but maintains the design. Maybe the pine cone part of the logo is offset to match where the heat transfer pad contacts leaving some black metal exposed to dissipate heat but that's also part of the lower skins design.
If I'm not explaining clearly please let me know and I can draw some pictures or something.
That makes sense. That could also cause a problem with the skin vinyl, too. Cheaper, or lighter duty vinyls don't always have any kind of heat resistance and can discolor, lose adhesion, and/or warp when exposed to excessive heat. Certain outdoor vinyls would probably still fair pretty well, though, since they are manufactured to handle elemental conditions that include heat, for a minimum number of years.
I think that since there are no fans we need to worry about blocking ventilation, we may be able to determine this ourselves, but measuring the bottom case temperatures while under load, and compare that to the specs of different vinyl options for skinning.
From my own experiences, so far, I haven't experienced enough heat emanating off the bottom case that would be considered damaging to any vinyl. However, if load temperature is high enough, and Pine expresses concern, we can also look at mylar materials as an option for skinning.
