I've recently had my PBP apart. I hadn't updated uboot to boot SD without the hardware switch thrown and I borked the eMMC install. oops. That's not my point. My point is I noticed the PBP processor is using a heat transfer pad to transfer heat to the bottom panel. So the bottom panel appears to be an active part of the cooling system. We'd probably want someone from Pine to let us know if we're putting our hardware at risk of heat issues if we're adding an extra layer over the bottom panel.
If the answer is "that would be bad" maybe there's a way to design a skin with a cut out that allows the heat out but maintains the design. Maybe the pine cone part of the logo could be cut out and offset to match where the heat transfer pad contacts leaving some black metal exposed to dissipate heat but that's also part of the lower skins design.
If I'm not explaining clearly please let me know and I can draw some pictures or something.
If the answer is "that would be bad" maybe there's a way to design a skin with a cut out that allows the heat out but maintains the design. Maybe the pine cone part of the logo could be cut out and offset to match where the heat transfer pad contacts leaving some black metal exposed to dissipate heat but that's also part of the lower skins design.
If I'm not explaining clearly please let me know and I can draw some pictures or something.
