05-23-2017, 10:07 AM
(05-23-2017, 02:08 AM)dkryder Wrote: interesting that all 3 chips end up within a couple degrees of each other and that the A64 has what looks like better ability to dissipate heat but never gets below the other 2 chips.
Yes, it's the biggest area and the largest number of balls connecting it to the board. I guess its dissipating a good deal more power and I wonder if the other chips are being heated significantly by the processor through the board. The whole assembly cools down pretty quickly, the mass is low compared to a conventional board.