06-07-2020, 07:43 AM
I had the same dilemma some time ago. In order to decide about connecting DRAMs to the heatsink of CPU, I have removed the heatsink and measured temperature on CPU and memory chips simultaneously.
I have tried to generate load on memory, but the temperature of the DRAMs has been constantly more than 10 degrees of Celsius lower than that of CPU. I think that connecting the DRAMs to the same heatsink with CPU is actually heating DRAMs. Not cooling them.
Thus, I have connected the tall heatsink to CPU only. I have used ARCTIC MX-4 thermal paste. The new one, with 8.5 W/(mK). I am surprised, how well it works. My ‘NAS’ has no enclosure, yet. CPU temperature under load never goes beyond 65 degrees of Celsius. Previously, without any pad or paste, it used to reach 74 degrees. I do not think, I will ever mount a heatsink without heat-conducting paste or pad. Not even for short test.
Still, I would not dare to put my RP64 to an enclosure without a fan. My enclosure will have fan with variable velocity. When I finally make it
.
I have tried to generate load on memory, but the temperature of the DRAMs has been constantly more than 10 degrees of Celsius lower than that of CPU. I think that connecting the DRAMs to the same heatsink with CPU is actually heating DRAMs. Not cooling them.
Thus, I have connected the tall heatsink to CPU only. I have used ARCTIC MX-4 thermal paste. The new one, with 8.5 W/(mK). I am surprised, how well it works. My ‘NAS’ has no enclosure, yet. CPU temperature under load never goes beyond 65 degrees of Celsius. Previously, without any pad or paste, it used to reach 74 degrees. I do not think, I will ever mount a heatsink without heat-conducting paste or pad. Not even for short test.
Still, I would not dare to put my RP64 to an enclosure without a fan. My enclosure will have fan with variable velocity. When I finally make it
.
