02-13-2022, 12:54 PM
Working on this some more, I've noticed one other potential required change: on page 7 of the schematic, there's a note: "If use eMMC 5.0, mount D. else, NC D. Or if use Flash NC D." Here "D" refers to a group of 3 resistors. This message is a little confusing to me - I guess NAND and eMMC are considered different things, even though according to EETimes eMMC "consists of a number of NAND flash memory devices and a controller in a single ball grid array (BGA) package." All this can probably be ignored until HS400 is supported anyway, since that's the only mode that requires eMMC 5.0.
It leads me to my next question though - how do you figure out which components on the board correspond to components in the schematics? My electronics experience is limited to through-hole hobbyist electronics and minor repairs on surface mount components on PCBs, not reverse engineering inputs and outputs to a BGA chip on a multi-layer PCB where most of the traces are invisible. A few searches for this process just turned up X-ray imaging or destructive delayering.
It leads me to my next question though - how do you figure out which components on the board correspond to components in the schematics? My electronics experience is limited to through-hole hobbyist electronics and minor repairs on surface mount components on PCBs, not reverse engineering inputs and outputs to a BGA chip on a multi-layer PCB where most of the traces are invisible. A few searches for this process just turned up X-ray imaging or destructive delayering.