12-15-2019, 09:15 AM
(12-15-2019, 05:05 AM)undo Wrote:(12-14-2019, 02:36 AM)murak Wrote: All the moving parts have to be automated so that they move back and forth in the right order while the mold opens and closes. It's especially hard to make the parts that have to move "inside" the case, like the small tap/lock in the picture above, since there is so little space.
Ok, I see the complexity. Is it not possible to modify the existing back cover design? Or do you need specific machinery designed for the particular back cover?
Maybe, but I kind of like having a hole for the headphones
seriously though, the tap/lock etc are probably there for a reason. If someone from pine64 is reading this, is there a picture of the mold? I for one would really like to see it 
"- is there already a tool for overclocking it desperately?"
