06-23-2019, 08:00 AM
(06-23-2019, 12:46 AM)tllim Wrote: with proper thermal compound on the L-shape heatpipe and ROCK64 SoC surface, the heat should be able distribute to whole Aluminum case.
Hi tllim!
For a picture from my Rock64 inside its housing see here: https://pasteboard.co/IkKDeQI.jpg
You see: The thermal compound shipped with the casing is attached underneath the heatpipe.
I monitored the temperature when appling load to the SBC (running stress -c 4 -m -t 5m), and the temperature stayed well below 80°C.
The crashes I see may not be linked to a thermal problem. I opened a thread in the DietPi forum.
Regards, Jan