Heat-sink as add-on?

[rahlquist]

I personally would rather see some big heatsink covering all 4 chips (with no fan if possible).
But somebody on this forum wrote height of all 4 chips is not equal.

Tllim is working with some vendor on making a heatsink.

Here is a enclosure for Raspberry PI made from aluminium with "cube" which connects enclosure body and surface of CPU. That might be the best passive heatsing from all the options (once are dimensions modified for PINE64).
http://raspi.tv/2014/the-flirc-case-for-raspberry-pi-b

Yeah they are definitely different height, and with the  curved boards, that presents a challenge. Also the 2Gb versions have ram chips on the bottom of the pcb as well.

This stuff might help with the uneven heights and curved boards: http://www.amazon.com/viscous-thermal-pa...B00UTX7K2E

Unlike regular thermal pastes, which are designed to flow under higher heat to fill in very small spaces between a chip and heat sink that's in tight contact with the top of the packaging through capillary action, this is very thick (like silly putty), very sticky (may not need clamps, depending on the application), and doesn't change phase when heated.  It's meant to replace thermal pads.  Of course, it's not going to transmit heat as efficiently as direct contact with high-grade thermal compounds, but it is designed to fill in larger gaps between a chip and heat sink.

I just received some and plan to try it out when I've got some time.

Never heard of the product before. Also I wouldnt want to use TIM material to make up those kind of gaps, proper machining maybe.