I do think that the board was reflow soldered, the components are just too small and tightly packed to be able to be soldered by hand easily. You need reflow soldering for the SoC and the RAM anyways, so it's at hand to program the machinery to also solder the 100s of tiny capacitors and resistors.
I managed to take a better shot at the microscope...
What I am asking is what quality management process is implemented where boards with such defects can slip through... Even at the prototype stage, production defects are one of the problems easiest to manage
I managed to take a better shot at the microscope...
What I am asking is what quality management process is implemented where boards with such defects can slip through... Even at the prototype stage, production defects are one of the problems easiest to manage